Supercomputing Center
This item in 0.5.6-beta (Normal) and in 0.6.0-dev19 (Expert), side by side.
Tooltip changed
0.5.6-beta (Normal)Supercomputing Center
Supercomputing Center
⭐ Computer Supercomputing Center
৹ Integrates multiple computers together to provide massive parallel computing power
- Level System
৹ Switch tiers by placing specific items in the mainframe
৹ Structure block tiers must match machine tier
- Computing Power Calculation System
# Max output = sum of component power × correction factor
৹ At levels 2/3, correction factor decays over time
# Decay: ((factor-0.4)²/5000)×(0.8/log(factor+6)), at least 0.8
- Thermal Conductivity Cooling Enhancement
৹ Input thermal conductivity via hatch to boost correction factor
# Enhancement limits: Tier 2(4) / Tier 3(16)
৹ Thermal conductivity becomes invalid after use
# MFPC efficiency: Block(0.18) Ingot(0.02) Nugget(0.0022)
# Cascade-MFPC efficiency: Block(0.54) Ingot(0.06) Nugget(0.0066)
# Ice Shards: 0.0001 (extremely low efficiency)
- Tier 1 : Supports HPCA Series Components
৹ Slot requirement: None
৹ Structure material requirements: Tungsten Borosilicate Glass + Computer Casing + Computer Heat Vent
৹ Coolant used: PCB coolant
- Tier 2 : Supports NICH Series Components
৹ Slot requirement: Place Biological Mainframe
৹ Structure material requirements: Neutronium Borosilicate Glass + Biocomputer Casing + Phase Change Biocomputer Cooling Vents
৹ Coolant: Liquid helium (will output gaseous helium)
- Tier 3 : Supports GWCA Series Components
৹ Slot requirement: Place Supracausal Mainframe
৹ Structure material requirements: Taranium Borosilicate Glass + Graviton Computer Casing + Anti Entropy Computer Condensation Matrix
৹ Coolant: Liquid helium (will output gaseous helium)
✔ Built-in cross-dimensional bridging capability
0.6.0-dev19 (Expert)Supercomputing Center
Supercomputing Center
Computer Supercomputing Center
Integrates multiple computers together to provide massive parallel
computing power
Running Requirements
The interior must be completely filled; empty components of the
matching tier can be used instead
Level System
Structure block tiers must match machine tier
Switch tiers by placing specific items in the mainframe
Computing Power Calculation System
Max output = sum of component power × correction factor
At levels 2/3, correction factor decays over time
Decay: ((factor-0.4)²/5000)×(0.8/log(factor+6)), at least 0.8
Thermal Conductivity Cooling Enhancement
Input thermal conductivity via hatch to boost correction factor
Enhancement limits: Tier 2(4) / Tier 3(16)
Thermal conductivity becomes invalid after use
MFPC efficiency: Block(0.18) Ingot(0.02) Nugget(0.0022)
Cascade-MFPC efficiency: Block(0.54) Ingot(0.06) Nugget(0.0066)
Ice Shards: 0.0001 (extremely low efficiency)
Tier 1 : Supports HPCA Series Components
Slot requirement: None
Structure material requirements: Tungsten Borosilicate Glass +
Computer Casing + Computer Heat Vent
Coolant used: PCB coolant
Tier 2 : Supports NICH Series Components
Slot requirement: Place Biological Mainframe
Structure material requirements: Neutronium Borosilicate Glass +
Biocomputer Casing + Phase Change Biocomputer Cooling Vents
Coolant: Liquid helium (will output gaseous helium)
Tier 3 : Supports GWCA Series Components
Slot requirement: Place Supracausal Mainframe
Structure material requirements: Taranium Borosilicate Glass +
Graviton Computer Casing + Anti Entropy Computer Condensation
Matrix
Coolant: Liquid helium (will output gaseous helium)
Built-in cross-dimensional bridging capability
Line only in 0.5.6-beta (Normal) Line only in 0.6.0-dev19 (Expert)